• 德淵EPOXY 單液型

EPOXY 51609 Non-Sag Resin For Potting

51609 is a thixotropic, one component heat curing epoxy resin, non-sagging, suitable for potting the sensor.

Specification

Main ingredient:Epoxy
Appearance:Black
Unit:KG
Packaging:1kg/can

Application

Potting

Procedures

Dispenser, manual

PRODUCTBRANDS
DENKA Co., Ltd.
TOYOBO Co., Ltd.
Chase Specialty Coatings
NOGAWA CHEMICAL Co., Ltd.
TAG Co., Ltd.
DAIKIN Co., Ltd.
KONISHI Co., Ltd.
SUNECON Co., Ltd.
OSHIKA Co., Ltd.
TOAGOSEI Co., Ltd.
UV Curable Adhesive
Epoxy Resin
2-Part Acrylic Adhesive
Cyanoacrylate

Quick Search for Suitable Products

  • Application