NEWS

In the field of precision electronics and optical assembly, adhesives play a role far beyond simple bonding—they directly determine structural stability and long-term durability. As components continue to shrink in size and designs grow more complex, traditional single-cure systems face limitations: incomplete curing in shadowed areas, or restrictions from heat-sensitive materials, often leading to lower yield and reduced reliability.
Our UV-Moisture Multi-Cure Technology combines the speed of UV light curing with the completeness of ambient moisture curing. UV curing provides instant fixture strength, while moisture curing continues to reinforce shadowed or inaccessible areas—ensuring both speed and integrity in the assembly process.
For automated assembly lines in electronics and optoelectronics (such as display panels, lens modules, optical components, etc.), UV adhesives can replace traditional tapes or screws. However, issues arise when structural design creates shadowed or opaque areas where UV light cannot fully reach, resulting in incomplete curing. A more ideal solution is required.
This adhesive first cures rapidly under UV light, providing initial strength (similar to tape with pressure-sensitive properties) to facilitate component handling. Substrates can be positioned and fixed with reduced fixture pressure. Subsequent room-temperature moisture curing enhances bonding strength, without additional heating, achieving complete curing even in deep, opaque, or shadowed areas. After curing, the adhesive delivers suitable adhesion and full physical performance across various substrates


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