Chip industry_Automation equipment_Application | 2-Part Acrylic Adhesive, Structural Acrylics, UV Resin, Cyanoacrylate manufacturer│TEX YEAR Since 1976

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APPLICATION

Chip industry

Chip industry

The upper reaches of the semiconductor industry chain are IP design and IC design industries, the middle reaches are IC manufacturing, wafer manufacturing, related production process testing equipment, masks, chemicals and other industries, and the lower reaches are IC packaging testing, related production process testing equipment, components, IC modules, IC channels and other industries. After the product design is completed.

 

The IC design company entrusts a professional wafer foundry or IDM factory to produce semi-finished wafers. After the first stage test, the IC design company transfers the wafers to a professional packaging factory for cutting and packaging. Finally, the professional testing factory conducts the second stage test. After the second test, the finished products are sold to the system manufacturer through the sales channel for assembly and production before becoming system products.


We provide ultra-high speed material supply for screening/arranging/conveying of micro parts on the automated production line to meet the speed and yield of customer capacity.

Product Name
Product Specification
Applications
Heat dissipating grease
GFC-N8
One-package liquid type. low thermal resistance, low oil penetration. Thermal conductivity 1.5 W/mK. High reliability.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Heat dissipating grease
GFC-PF3
One-package liquid type. Low viscosity, high thermal conductivity type. Thermal conductivity 3W/mK.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Heat dissipating grease
GFC-R8
Two-package liquid type. Paste coated, room temperature curing. Pump-out resistant. Thermal conductivity 3.6 W/mK.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Heat Spacer
FSL-BS
It has both flexibility and high heat conductivity, with a thickness of 0.5~3mm. Thermal conductivity 3W/mK. The highest compression ratio is 30%. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Heat Spacer
FSL-BH
It is the thickness corresponding type, with the maximum thickness of 5mm. Thermal conductivity 3W/mK. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components
Heat sheet
FSL-HR
8W/mK, ultra-high heat conduction type. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components
Heat sheet
M series
It is a basic universal type. The thickness is 0.2~0.8mm. Heat conductivity is 1.5W/mK. Voltage withstand guarantee. Flammability rating is UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Heat sheet
BFG-A series
High reliability, applicable to electric vehicle parts. Heat conductivity 5W/mK. Voltage withstand guarantee. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Heat sheet
BFG-C series
Ultra-high thermal conductivity type. Heat conductivity 8W/mK. Voltage withstand guarantee. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
360Hz~600HZ
drive unit
Number of vibrations per second: 360~600Hz.
Low reaction force.
Increased frequency, less runout, less damage to parts.
Passive components, MLCCs, quartz chips, LEDs.
CCD
Ultra-high frequency
vibrators
Self-developed software for faster processing.
Easy adjustment with digital piezoelectric valve.
Passive components, LEDs.
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