HumiSeal® Peelable Mask

HumiSeal® Peelable Mask

HumiSeal® TempSeal TS300 is a non-flammable, high temperature, temporary peelable mask specially designed and formulated to be used on printed circuit boards that require masking during the conformal coating process.
  • HumiSeal® Peelable Mask TS-300
    HumiSeal® Peelable Mask TS-300
PRODUCTBRANDS
DENKA Co., Ltd.
TOYOBO Co., Ltd.
Chase Specialty Coatings
NOGAWA CHEMICAL Co., Ltd.
TAG Co., Ltd.
DAIKIN Co., Ltd.
KONISHI Co., Ltd.
SUNECON Co., Ltd.
OSHIKA Co., Ltd.
TOAGOSEI Co., Ltd.
UV Curable Adhesive
Epoxy Resin
2-Part Acrylic Adhesive
Cyanoacrylate

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