Denka® Thermally conductive interface materials / Thermal dissipative materials_Functional material_Products | 2-Part Acrylic Adhesive, Structural Acrylics, UV Resin, Cyanoacrylate manufacturer│TEX YEAR Since 1976

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Denka® Thermally conductive interface materials / Thermal dissipative materials

Denka® Thermally conductive interface materials /  Thermal dissipative materials

Denka Thermally conductive interface materials / Thermal dissipative materials|You can choose from thermal paste, thermal gasket or thermal spacer.

 

It can effectively conduct the heat generated by transistors, IC drivers, etc. and at the same time ensure the insulation characteristics, suitable for various electronic, automotive and battery cooling needs.

 

The thermal conductivity ranges from 1.5W/mK to 8W/mK.

 

Some products have a flame-resistance rating of UL 94V-0

液態散熱材料,具有優異的耐熱性和耐寒性。 可用於MPU和IC等高熱密度電子元件的散熱措施。多用於伺服器與汽車部件。。

片狀散熱材料,內部以玻璃纖維作為補強材,具備高強度與高導熱性,易操作;多應用於車載部品散熱片與電源模組散熱片。

散熱墊片 Spacer 可以對應CPU和MPU等電子元件的不規則性,讓熱源有效地傳遞。適用於基地台與平板電腦。

Product Name
Product Specification
Applications
Industry
Heat dissipating grease
GFC-N8
One-package liquid type. low thermal resistance, low oil penetration. Thermal conductivity 1.5 W/mK. High reliability.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Automotive Electronics
Chip industry
Heat dissipating grease
GFC-PF3
One-package liquid type. Low viscosity, high thermal conductivity type. Thermal conductivity 3W/mK.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Automotive Electronics
Chip industry
Heat dissipating grease
GFC-R8
Two-package liquid type. Paste coated, room temperature curing. Pump-out resistant. Thermal conductivity 3.6 W/mK.
It can be used for heat dissipation of vehicle mounted and electronic components. It can correspond to the automatic dispensing machine.
Automotive Electronics
Chip industry
Heat Spacer
FSL-BS
It has both flexibility and high heat conductivity, with a thickness of 0.5~3mm. Thermal conductivity 3W/mK. The highest compression ratio is 30%. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Automotive Electronics
Chip industry
Heat Spacer
FSL-BH
It is the thickness corresponding type, with the maximum thickness of 5mm. Thermal conductivity 3W/mK. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components
Automotive Electronics
Chip industry
Heat sheet
FSL-HR
8W/mK, ultra-high heat conduction type. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components
Automotive Electronics
Chip industry
Heat sheet
M series
It is a basic universal type. The thickness is 0.2~0.8mm. Heat conductivity is 1.5W/mK. Voltage withstand guarantee. Flammability rating is UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Automotive Electronics
Chip industry
Heat sheet
BFG-A series
High reliability, applicable to electric vehicle parts. Heat conductivity 5W/mK. Voltage withstand guarantee. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Automotive Electronics
Chip industry
Heat sheet
BFG-C series
Ultra-high thermal conductivity type. Heat conductivity 8W/mK. Voltage withstand guarantee. Flammability rating UL 94V-0.
It can be applied to heat dissipation of 5G, electronic and vehicle mounted components.
Automotive Electronics
Chip industry
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