Tex Year's underfill sold is primarily composed of epoxy resin. This underfill is mainly applied after the reflow soldering process, where it is spread onto the printed circuit board (PCB) and subsequently cured. It is primarily used to encapsulate the underside of the silicon chip, protecting the fragile interconnecting solder joints that link the chip's underside to the top side of the PCB. This underfill product offers high support, excellent stability, and shock protection for the chip, preventing the impact of factors such as moisture and ionic residues.
Tex Year's underfill demonstrates high stability and reliability, with excellent component adhesion to the substrate, making it particularly suitable for bottom-filling requirements in electronic components.
Key features of Tex Year's underfill include:
• Fast curing at high temperatures.
• Re-workable characteristics.
• Applicability to various bottom-filling applications, including BGA, FC, CSP, and more.
• Suitable for a range of industries, including electronics, 5G/6G communication, and automation controllers.